To overtake Taiwan Semiconductor Manufacturing Co. as the market leader in global foundries, Samsung Electronics announced that it will begin using its most advanced 2-nanometer chips in mobile applications in 2025, followed by high-performance computing (HPC) in 2026, and automobiles the following year.
In a meeting held in the United States, the South Korean tech giant unveiled the comprehensive road map for its foundry division, which creates customised chips for corporate clients.
"The company will begin mass production of 2-nm process for mobile applications in 2025, and then expand to HPC in 2026 and automotive in 2027," Samsung said in a news release. "Samsung's 2-nm process has shown a 12% increase in power efficiency, and a 5% decrease in area, when compared to its 3-nm process."
The announcement comes at a time when international chipmakers are vying with one another to create cutting-edge semiconductors to meet the rising demand for their use in more complicated and advanced goods. The term "nanometer" in chip manufacturing refers to the distance between transistors on a chip. The more complex and powerful something is, the smaller it is.
Currently, 4-nm technology is used to manufacture mobile chips, such as the one used in the premium iPhone 14 Pro and Nvidia's graphic processors.
Last month, Samsung CEO Kyung Kye-hyun admitted that his company lagged behind TSMC in foundry technology, but he promised to catch up to his competition in five years.
"Samsung Electronics is one year behind ... TSMC in 3-nm [chip] quality and two years in 4-nm," Kyung said in a speech to students at the Korea Advanced Institute of Science and Technology in Daejeon. "However, we are thinking [we will catch up] in five years. We will do our best to become the world's best in technology."
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