With the new Arm Total Compute Solutions 2023 (TCS23), which include the Arm Cortex-X4, Arm Cortex-A720, and Arm Cortex-A520 CPUs and Immortalis-G720, Mali-G720, and Mali-G620 GPUs, Cadence Design Systems announced it has continued to expand its collaboration with Arm to advance mobile device silicon success. This gives customers a faster path to tapeout.
To assist clients in achieving power and performance targets with the new Arm TCS23, Cadence provided thorough RTL-to-GDS digital flow Rapid Adoption Kits (RAKs) for 3nm and 5nm nodes through this most recent partnership.
The Cadence Cerebrus Intelligent Chip Explorer, Genus Synthesis Solution, Modus DFT Software Solution, Innovus Implementation System, Quantus Extraction Solution, Tempus Timing Signoff Solution and ECO Option, Voltus IC Power Integrity Solution, Conformal Equivalence Checking and Conformal Low Power are some of the Cadence tools that have been optimised for the new Arm TCS23. Arm was given the ability to accomplish power, performance, and area (PPA) targets more quickly thanks to Cadence Cerebrus' AI-driven design optimisation capabilities, which led to 50% better timing (TNS), a 10% reduction in cell area, and a 27% improvement in leakage power on the Cortex-X4 CPU.
The digital RAKs provide Arm TCS23 users a number of significant advantages. For instance, compared to a human, iterative process, the AI-driven Cadence Cerebrus automates and scales digital chip design, improving client productivity. Faster design closure is made possible by Cadence iSpatial technology's integrated implementation pipeline, which improves predictability and PPA.
The RAKs also include a cutting-edge smart hierarchy flow that permits quicker processing speeds on big, powerful CPUs. For correct signoff and complete design closure, the Tempus ECO Option, which offers path-based analysis, is integrated into the flow.
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